Research in electronics and nanotechnology that include electrical, mechanical, thermal, fabrication and assembly related issues pertinent to advanced devices, circuits, ICs, packaging and systems.

The Center for Co-design of Chip, Package, System conducts leading-edge research in the following areas:
   • System Architecture, Planning, Modeling and Implementation
   • IC Floor Planning, Place & Route, Design, Modeling and Characterization
   • Advanced Packaging, Substrate Fabrication, Modeling and Characterization
   • Advanced Interconnect and 3D Integration Technologies
   • Electronic Design Automation that includes Physical CAD and Multi-physics Modeling
   • Emerging Device and Interconnect Technologies

Center Contact

Center Director: Madhavan Swaminathan 
John Pippin Chair in Electromagnetics; Professor
Director, Center for Co-design of Chip, Package, System (C3PS),
School of Electrical and Computer Engineering | 404.894.3340

Visit the Center Website at this Link.